Lee Tong Hua

Position:Patent Engineer
Email:tonghua.lee@spruson.com

Academic Qualifications

Qualification Institution Year of Completion
Masters of EngineeringSingapore University of Technology and Design2021
Masters of ScienceChang Gung University2021
Bachelor of EngineeringNewcastle University, United Kindgom2017

Selected Publications – industry/IP specific

Publications
[Co-Author] Chew Beng Soh et al. (2017), “Regrowth of GaN on Strain-relief porous GaN template fabricated by Anodized Alumina Oxide mask”, Procedia Engineering.
Experience and Technical Background

Experienced in the following areas of patent practice:

  • Patent Drafting
  • Local and Foreign Patent Prosecution

Primary patent practice areas by technology:

  • Engineering & Manufacturing
  • ICT, Electronics & Software

Research/industry background:

A. General technical areas:

  • Semiconductor/MEMS
  • Electrical Engineering

B. Honours research:

  • Fabricated and characterized a Gallium Arsenide based laser device using the techniques of micro-fabrication.
  • Characterize and analysing the density reduction of deep level traps in InGaN LED using Deep Level Trap Spectroscopy.

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