Lee Tong Hua

Position:Patent Engineer
Email:tonghua.lee@spruson.com

Academic Qualifications

Qualification Institution Year of Completion
Graduate Diploma in IP and Innovation Management (Patent Agency)(GDIPIM)Singapore University of Social Sciences2024
Masters of EngineeringSingapore University of Technology and Design2021
Masters of ScienceChang Gung University2021
Bachelor of EngineeringNewcastle University, United Kingdom2017

Selected Publications – industry/IP specific

Publications
[Co-Author] Chew Beng Soh et al. (2017), “Regrowth of GaN on Strain-relief porous GaN template fabricated by Anodized Alumina Oxide mask”, Procedia Engineering.
Experience and Technical Background

Experienced in the following areas of patent practice:

  • Patent Drafting
  • Local and Foreign Patent Prosecution

Primary patent practice areas by technology:

  • Engineering & Manufacturing
  • ICT, Electronics & Software

Research/industry background:

A. General technical areas:

  • Semiconductor/MEMS
  • Electrical Engineering

B. Honours research:

  • Fabricated and characterized a Gallium Arsenide based laser device using the techniques of micro-fabrication.
  • Characterize and analysing the density reduction of deep level traps in InGaN LED using Deep Level Trap Spectroscopy.

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